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A Semiconductor Manufacturing and Design Community

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    Over the last two decades, chemical mechanical polishing (CMP) has become a mainstay in the IC manufacturing process. Foundries employ it to remove excess materials from silicon wafers and to smooth wafer layers, such as front-end-of-line (FEOL) layers like shallow trench isolation (STI) and back-end-of-line (BEOL) layers like metal interconnect. As one might expect, with the introduction of each new process, CMP has become exponentially more sophisticated, and employed with greater frequency. And the process is not without risks—CMP can create new defects through over- and under-polishing.

older | 1 | (Page 2)